Virtual Labs

a: Cross-sectional TEM sample preparation process makes available larger region of interest available for imaging b: Cross-sectional TEM sample preparation process makes usage of higher kV for imaging and can provide higher resolution c: Cross-sectional TEM sample preparation process requires lesser number of steps d: Cross-sectional TEM sample preparation process is faster as it uses electrochemical etching.

2. Cross-sectional TEM sample preparation is NOT preferred for imaging:

a: Modified top-surface via chemical treatment b: Nano-crystallites in a bulk matrix c: Interface between coating and substrate d: d. Nano-textured layers during multi-pass rolling of samples

3. An important precaution to be observed for processing the cross-sectional TEM sample is:

a: To preserve the sliced pieces in protected atmosphere and avoid their oxidation b: Carefully slicing the samples to thickness of less than 1 mm c: Utilising liquid nitrogen for the dimpling of samples d: Preparing the surface for TEM observation using electrochemical etching

4. What problem may NOT crop up during mounting of the sliced samples for cross-sectional TEM:

a: Buoyancy effects may lift the samples up during pouring of epoxy/resin b: Shifting of samples may occur during c: Alignment of interface region may occur during mounting d: Ion beam etching will not work on the mounted samples

5. The sectioned samples are kept placed on the mount with the interface region facing:
Note: Larger region of interest is exposed for imaging.

a: Parallel to top surface b: Perpendicular to top surface

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